The primary function of red glue is to enhance the adhesion of components, preventing displacement or detachment during the reflow process, and ensuring the stability of large components. It is predominantly used in SMT (Surface Mount Technology) assembly and wave soldering processes, with applications spanning industries such as consumer electronics (e.g., smartphones, watches), household appliances, automotive electronics, and others.

In the process of red glue dispensing, key process parameters ensuring dispensing effectiveness include dispensing quantity control, dispensing force, dispensing precision, dispensing speed, and single-point dispensing volume. Equipment operating speed is crucial for maintaining dispensing efficiency.

The increasing integration density of PCBs results in reduced dispensing space and an increased number of dispensing locations. Consequently, the industry trend in the red glue sector revolves around achieving smaller single-point dispensing and enhancing equipment speed for frequent acceleration and deceleration movements. This trend emphasizes smaller single-point dispensing, faster spatial movement speeds.

With years of accumulated experience in red glue application, our company has developed mature and reliable products and solutions. In response to future demands, we have intensified our research and development efforts, achieving significant breakthroughs in core technical areas such as smaller single-point dispensing, faster operating speeds, smarter path optimization, and higher-frequency valve bodies.