FLEXIBLE

MYD series can handle different substrate sizes and compositions to meet specific process requirements.

Numerous applications can be achieved with optional features such as tilt and rotate, contact

and non-contact heating and dual head configurations.

COST-EFFICIENT

Smaller machine dimensions, high-quality build and streamlined mechanical design allow the system to

run for longer periods of time with less maintenance and lower downtimes. Our Piezo Jetting technology

has been designed with a reduced number of wear parts, further reducing the cost of ownership making

the MYD series a cost-effective dispensing solution.

IMPROVED PRODUCTIVITY

Precise temperature controls, on-the-fly fiducial search, robust vision algorithms, low motion Z axis

and non-contact dispensing are some feautures to increase productivity.

KEY APPLICATIONS,CONSUMER ELECTRONICS

• Hot melt     • Underfill     • Pin encapsulation    • Edge/corner bonding    • Surface mount package

• Package on package     • Dam and fill    • SMA    • FPC component        • Reinforcement materials